LQLBT2012T4R7M [TAIYO YUDEN]
General Purpose Inductor, 4.7uH, 20%, 1 Element, Ferrite-Core, SMD,;
| 型号： | LQLBT2012T4R7M |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | General Purpose Inductor, 4.7uH, 20%, 1 Element, Ferrite-Core, SMD, 测试 射频感应器 电感器 |
| 文件： | 总13页 (文件大小：483K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
高周 波巻線チップインダクタ
WOUND CHIP INDUCTORS
FOR HIGH FREQUENCY
LBH SERIES
OPERATING TEMP.
K25VJ85C
特長ꢀFEATURES
Y実装上の特性を重 視した形状。
Y巻線タイプのため、High Qで自己共振周 波数が高い。
YDimention attaches much importance to characteristics of mount case.
YThe product has excellent Q and SRF because, wound chip inductor.
用途ꢀAPPLICATIONS
Y携帯電話や無線LAN等の高周 波機器
YPortable telephones and wireless LAN.
形名表記法ꢀORDERING CODE
1
3
4
5
インダクタンス許容差
包装
B
形式
LBH
公称インダクタンス
例
〔μH〕
高周 波巻線巻線チップインダクタ
単品
J
M5
L
T
テーピング
3N9
10N
R10
0.0039
0.01
0.1
D
M0.5nH
FNW 小数点
2
6
外径寸法 hmmi
当社管理記号
QQQ
1608(0603)
1.6P0.8
標準品
QW スペース
1 6 0 8 T 1 0 N J Q Q Q Q
L B H
3
4
5
6
1
2
1
4
5
3
Inductance Tolerances
Packaging
B
T
Type
Nominal Inductance〔μH〕
Wound chip inductors
for high frequency
Bulk
example
J
M5%
LBH
Tape & Reel
3N9
0.0039
0.01
0.1
D
M0.5nH
10N
R10
*N=decimal point
2
6
External Dimensions hmmi
1608(0603) 1.6P0.8
Internal code
QQQ
Standard Products
QWBlank space
222
外形寸法ꢀEXTERNAL DIMENSIONS
Type
L
W
T
1.6M0.1
0.8M0.1
0.8M0.1
LBH1608
(0.063M0.004)
(0.031M0.004)
(0.031M0.004)
UnitDmmfinchg
5
概略バリエーションꢀAVAILABLE INDUCTANCE RANGE
Type
LBH1608
Range
Imax[mA]
Rdc M30L[E]
2.7nH
1000
0.03
2.7
EEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEE
600
0.10
10
200
0.90
100
EEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEE
100nH
Inductance
Imax[mA]
Rdc M30L[E]
2.7nH
10nH
1000
600
0.03
0.10
0.90
100nH
200
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
–––
P.226
P.10
etc
P.224
P.224
P.225
223
アイテム一覧ꢀPART NUMBERS
LB2012 TYPE
自己共振
公称
インダクタンス
許容差
電
ꢀ
波数
Measuring
frequency
hMHzi
形ꢀꢀ名
Q
周
波 数
DC
Resistance
hEi
Rated
current
hmAi
周
インダクタンス
Self-resonant
frequency
hMHzi
値
Inductance
hAHi
1.0
Inductance
Tolerance
Typical Value
Ordering code
fM30Lg
max.
min.
LB2012G1R0M
LB2012G2R2M
LB2012G4R7M
LB2012G100M
LB2012G100MR
LB2012G220M
LB2012G470M
LB2012G101M
100
80
45
32
32
16
11
8
0.15
0.23
0.4
300
240
140
100
100
75
2.2
5
7.96
4.7
10
0.7
0.5
1.7
3.7
M20L
10
2.52
22
10
47
50
100
7.0
30
0.796
Y注D形名のG
K公差品
包装記号が
。 YG Please specify the packaging code.fTDTape&Reel, BDBulkg
い。
し
、
LB2016 TYPE
形ꢀꢀ名
自己共振
公称
インダクタンス
許容差
電
ꢀ
周 波数
Measuring
frequency
hMHzi
Q
周
波 数
DC
Resistance
hEi
Rated
current
hmAi
インダクタンス
Self-resonant
frequency
hMHzi
値
Inductance
hAHi
1
Inductance
Tolerance
Typical Value
Ordering code
fM30Lg
max.
min.
LB2016G1R0M
LB2016G1R5M
LB2016G2R2M
LB2016G3R3M
LB2016G4R7M
LB2016G6R8M
LB2016G100M
LB2016G150M
LB2016G220M
LB2016G330M
LB2016G470M
LB2016G680M
LB2016G101M
Y注D形名のG
100
80
70
55
45
38
32
28
16
14
11
10
8
0.09
0.11
0.13
0.2
455
350
315
280
210
175
155
130
105
85
1.5
2.2
7.96
3.3
4.7
0.25
0.35
0.5
6.8
10
M20L
10
15
0.7
22
1.0
2.52
33
1.7
47
2.4
60
68
3
50
100
4.5
40
0.796
包装記号が
し 、
。 YG Please specify the packaging code.fTDTape&Reel, BDBulkg
い。
K公差品
LB2518 TYPE
形ꢀꢀ名
自己共振
公称
インダクタンス
Inductance
hAHi
1
インダクタンス
許容差
電
Rated
current
hmAi
ꢀ
周 波数
Measuring
frequency
hMHzi
Q
周
波 数
DC
Resistance
hEi
Self-resonant
frequency
hMHzi
値
Inductance
Tolerance
Typical Value
Ordering code
fM30Lg
max.
min.
LB2518G1R0M
LB2518G1R5M
LB2518G2R2M
LB2518G3R3M
LB2518G4R7M
LB2518G6R8M
LB2518G100M
LB2518G150M
LB2518G220M
LB2518G330M
LB2518G470M
LB2518G680M
LB2518G101M
LB2518G151M
LB2518G221M
LB2518G331M
LB2518G471M
LB2518G681M
LB2518G102M
Y注D形名のG
100
80
68
54
46
38
30
23
19
15
12
9..5
9
0.06
0.07
0.09
0.11
0.13
0.15
0.25
0.32
0.5
500
400
340
270
240
195
165
145
115
95
1.5
2.2
7.96
2.52
3.3
4.7
6.8
10
15
22
M20L
10
33
0.7
47
0.95
1.5
85
68
70
100
2.1
55
150
7
3.2
45
220
5.5
4.5
3.5
3
4.5
35
330
7
30
0.796
0.252
470
10
25
680
17
20
1000
2.4
24
15
包装記号が
し 、
。 YG Please specify the packaging code.fTDTape&Reel, BDBulkg
い。
K公差品
220
特性図ꢀELECTRICAL CHARACTERISTICS
重
特性例 DC Bias characteristics (Measured by HP4285A+42841A)
LB2012
LB2016
LB2518
1000
1000
1000
101M
101K
101M
100
10
100
10
100
10
100M
100K
100M
1R0M
1R0M
1000
1R0M
1000
1
1
1
5
0.1
10
0.1
10
0.1
1
100
10000
100
10000
10
100
1000
特性例 Temperature characteristics (Measured by HP4285A)
LB2012
LB2016
LB2518
15
15
100M
101M
1R0M
100M
10
10
5
101M
1R0M
100K
101K
5
1R0M
0
5
0
5
10
15
10
15
221
1/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LEM2520
LER015
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
K40VJ85C
1.Operating tem-
perature Range
2.Storage
K25VJ85C
K25VJ85C
K25VJ85C
K25VJ105C
CM03MS Series
Including self generated heat
K
CM03MS Series
K40VJ85C
K40VJ85C
Tape and reel condition is Within
K5V40C
Within the specified tolerance
3.Rated Voltage
The maximum DC value having inductance
decrease within 10L and temperature
increas within 20C by the application of DC
bias.
5
CM03MS series
The maximum DC value having tempetature
within specified temperature as detailed in
individual specifications.
Within the
specified toler-
ance
4.Impedance
5.Inductance
CM03MS Series
KKKKKKKKKKKKKKKKK
Measuring equipment 4291A fHPg or equivalent
Measuring frequency Specified frequency
LER LEM Series 5N6VR10
Within the specified tolerance
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
Measuring frequency Specified frequency
LER LEM Series R12V221
Measuring equipment LCR Meter
fHP4285A 42851A or its equivalentg
Measuring frequency Specified frequency
LB Series
Measuring equipment LCR Mater
fHP4285A or its equivalentg
LBH1608 Series
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
Within the specified tolerance
12V18fat 100MHzgmin
6.Q
LER LEM Series 5N6VR10
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
Measuring frequency Specified frequency
LER LEM Series R12V221
Measuring equipment LCR Meter
fHP4285A 42851A or its equivalentg
Measuring frequency Specified frequency
LB Series
Measuring equipment LCR Mater
fHP4285A or its equivalentg
LBH1608 Series
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
LER LEM LB LBH Series
Measuring equipment low ohmmeter
fA&D AD5812 or its equivalentg
CM03MS Series
Within the specified tolerance
7.DC Resisitance
Measuring equipment CD ohmmeter
227
2/8
RELIABILITY DATAꢀꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
8.Self-Resonant
Frequency
Within the specified tolerance
LER LEM Series
5N6VR10
Measuring equipment Network analyzer
fHP8720B or its equivalentg
LER LEM Series fExclude LEM2520g
R12V
Measuring equipment Impeadnce nanlyzer
fHP4291A or its equivalentg
5
LEM2520
Measuring equipment Network analyzer
fAnritsu MS620J or its equivalentg
LB Series
Measuring equipment Impedance analyzer
fHP4291A or its equivalentg
LBH1608 Series
Measuring equipment Network analyzer
fHP8720B or its equivalentg
9.Temperature Char-
acteristic
L/L WithinM5L
QL/LC
Within
M10L
QL/LC
Within
M5L
QL/LCWithinM15L
QL/LC
Within
M10L
QL/LC
Within
M15L
QL/LCWithinM5L
L/LCWithinM0.5nH
under 8.2nH
Change of maximum inductance deviation
in step 1K5
Exclude CM03MS series
Step
Temperture fCg
1
2
3
4
5
20
K25
20 fReference temperatureg
J85 fMaximum operating temperatureg
20
Warp: 2mm (LER012, LER015, LB)
: 3mm (LEM2520, LEMC2520, LEMF
2520, LEMC3225, LEMF3225)
Test substrate: Printed board
Accoding to JIS C0051
10.Rasistance to Flex- No breakdown or damage
ure of Substrate
Can satisfy the
conditions of the
chart at right.
CM03MS
Warp
Pressing speed 0.5mm/sec.
Duration 5M1sec.
2mm
Pressig jig
Board
11.Body Stregght
No breakdown or damage
LER
LER012 LER015
Applide forde 15N
Duration 5sec.
LEMYLBYLBH
LEM2520 LEMC2520 LEMF2520
LEMC3225 LEMF3225
Applide forde 10N
Duration 10sec.
12. Self Resonant
Freguency
L/L WithinK10L
LER LEM LB
Measure inductance with application of rated
current using LCR metre to cpmpare it with
the initial value. f* Excluding 5N6VR10g
229
3/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LEM2520
LER015
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
13.Adhesion of terminal Shall not come off
No detachment of electrode
Shall not come off PC board.
LER
electrode
PC board.
LER012YLER015
Applied force 15N
Duration 5 sec.
Test substrate Printed board
LEM LBYLBH
5
LEM2520YLEMC2520YLEMF2520Y
LEMC3225YLEMF3225
Applied force 10N to X and Y directions
Duration 5 sec.
Test substrate Printed board
14.Resistance to vibra-
tion
L/L
L/L WithinM5L
L/L WithinM10L
No significant Impedance
LER LEM LBYLBH
WithinM5L
Q
No significant abnormality in appearance. No significant abnormality in appearance.
abnormality Refer to individual According to JIS C5102 clause 8.2.
in appear- specification.
Vibration type
5N6V18N
10min.
ance.
DC resisitance
Refer to individual
specification.
Directions 2 hrs each in X, Y and Z direc-
tions. Total 6 hrs
22NVR10
15min.
Frequency range 10 to 55 to 10 Hz f1min.g
Amplitude 1.5mm
Insulation
R12V1R0
25min.
resisitance
Mounting method Soldering onto printed board
Refer to individual
specification No
f
*
Excluding 5N6-R10 LE
1R2V3R3
20min.
Seriesg
disconnection or Recovery At least 1 hr of recovery under
short circuit.
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
L/L
WithinM5L
Q
10NV18N
10min.
CM03MS Series
According to JIS C 0040
22NVR10
15min.
Vibration type
Directions 2 hrs each in X, Y and Z direc-
tions. Total 6 hrs
R12V100
30min.
Frequency range 10 to 55 to 10 Hz f1min.g
Amplitude 1.5mm fBut don't exceed accel-
eration 196m/s ftwo powergg
Mounting method Soldering onto printed
board
120V220
20min.
Recovery At least 1 hr of recovery under
the standard condition after the
test, followed.
231
4/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LEM2520
LER015
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
No significant
L/L WithinM5L
L/L
No signifiant abnormal- LERYLEM
ity in appearance. LER012YLER015
Drop test
15.Drop test
abnormality No significant abnormality in appearance.
WithinM10L
No significant
abnormality
in appear-
ance.
in appear-
ance.
Impact material concreta or vinyl tile
Height 1m
Total number of drops 10 times
5
LEM2520YLEMC2520YLEMF2520Y
LEMC3225YLEMF3225
Acceleration 980m/sec2
Duration 6msec
Number of times 6 sides P 3 times
Mounting method Soldering onto printed board
f* Excluding 10NVR10g
Recovery At least 1 hr of recovery under
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
At least 90L of electrode
At least 75L of
16.Solderability
LERYLEM
terminal electrode Solder temperature 230M5C
is covered by new Duration 2M0.5sec. fLER012YLER015g
solder.
5M0.5sec. fLEM2520Y
LEMC2520YLEMF2520Y
LEMC3225YLEMF3225g
Fiux Methanol solution with 25L of
colophony
LBYLBH
Solder temperature 230M5C
Duration 5M0.5sec
Fiux Methanol solution with 25L of
colophony
CM03 Series
CM03MS
Solder temperature
Duration
240M5C
3M1sec.
Immersion
233
5/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LEM2520
LER015
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
17.Resisitance to
soldering heat
No significant abnormality in appearance
Impedance
Conduct following wave soldering twice.
Refer to individual fLER012g
specification.
DC resisitance
Refer to individual
specification.
Insulation
5
resisitance
Refer to individual
specification, No
disconnection or
short circuit.
Solder temperature 260M5C
Duration 5M0.5sec. Twice fLERO15g
10M1sec. Once fLEM2520Y
LEMC2520YLEMF2520Y
LEMC3225YLEMF3225g
LBYLBH
3 times of reflow oven at 220 M 5C for
40sec.with peak temperature at 235M 5C
for 5sec.
CM03MS Series
Reflow soldering
Preheating 100 to 150C 1 to 2min.
Peak 230 to 240C Within 5sec.
More then 200 Within 40 sec.
Number of reflow Within 2 times.
Manual soldering
Solder temperature 350M5C
Duration 3M1sec.
Recovery 1 to 2 hrs of recovery under the
standard condition after the test
LEM
18.Resisitance to
soolvent
No significant abnormality in appearance.
Solvent temperature Room temperature
Type of solvent Chlorocarbon type
fLEM2520YLEMC2520Y
LEMC3225g
Isopropyl alcohol
fLEMF2520YLEMF3225g
Cleaning conditions Output 20mW/cm3
Frequency 28kHz
Duration 1 min
Conduct ultrasonic
cleaning.
fLEM2520YLEMC
2520YLEMC3225g
90s. Immersion and
cleaning.
fLEMF2520YLEMF
3225g
235
6/8
RELIABILITY DATA
Specified Value
Item
Test Methods and Remarks
LER012
LER015
LEM2520 LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
19.Resisitance to
solvent
L/L
L/L
L/L WithinM10L
L/L
Impedance
Conditions for 1cycle
WithinM10L WithinM10L
Step TemperaturefCg TemperaturefCg Durationfming
WithinM5L
L/L
Refer to individual
specification.
Q
Q
1
2
K25
J85
K40
J85
30
30
5N6V18N
10min.
10N 10min.
12NV33N
15min.
withinM0.5nH DC resisitance
under
8.2
Q/Q
Refer to individual
specification.
Insulation
22NVR10
15min.
Temperature for LER012YLER015
Temperature for
H
39NVR10
20min.
5
R12V1R0
25min.
LEM2520YLEMC2520YLEMF2520Y
LEMC3225YLEMF3225
withinM20L resisitance
Refer to individual
R12V4R7
30min.
1R2V3R3
20min.
Number of cycle 100 cycle
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
specification No
disconnection or
short circuit.
5R6V330
25min.
L/L
390V 820
WithinM10L 20min.
Q
101 15min.
10NV18N
10min.
LBYLBH
K40VJ85C, miantain times 30min. ,100 cycle
Recovery At least 1 hr of recovery under
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
22NVR10
15min.
R12V100
30min.
120V220
20min.
CM03MS Series
Accoding to JIS C0025
TemperaturefCg Durationfming
CM03MS
1
2
3
4
K40M3C
30M3
3
Room temperature
85M30
C
30M3
3
Room temperature
Number of cycle 10 cycle
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber.
L/L WithinM10L
L/L
Impedance
20.Damp heat
L/L
L/L
Temperature 60M2C
WithinM5L
L/L
Refer to individual
specification.
WithinM10L WithinM10L
Humidity 90V95LRH
Q
Q
Duration 1000 hrs
10N 10min.
12NV33N
15min.
withinM0.5nH DC resisitance
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
5R6V18N
10min.
under
8.2
Q/Q
Refer to individual
specification,
Insulation
H
22NVR10
15min.
39NVR10
20min.
WithinM20L resisitance
Refer to individual
R12V1R0
25min.
R12V4R7
30min.
CM03MS Series
CM03MS
specification, No
disconnection or
short circuit.
1R2V3R3
20min.
5R6V330
25min.
Temperature
Humidity
60M3C
90V95LRH
24
L/L
390V820
Duration
500Mꢀ
0
WithinM10L 20min.
Q
101 15min.
10NV18N
10min.
22NVR10
15min.
R12V100
30min.
120V220
237
7/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LEM2520
LER015
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
LERYLEMYLB
21.Loading under
damp heat
L/L
L/L
L/L WithinM10L
L/L
Impedance
Temperature 60M2C f*注ꢀExcluding nH
rangeg
WithinM10L WithinM10L
WithinM5L
L/L
Refer to individual
specification.
DC resisitance
Refer to individual
specification.
Insulation
Q
Q
Humidity 90V95LRH
R12V1R0
25min.
1R2V3R3
20min.
R12V4R7
30min.
within
0.5nH
under
Duration 1000 hrs
Applied current Rated current
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
5R6V330
25min.
8.2
H
5
390V820
20min.
Q/Q
resisitance
L/L
withinM20L Refer to individual
specification, No
WithinM10L
Q
101 15min.
disconnection or
CM03MS Series
CM03MS
R12V100
30min.
short circuit.
Temperature
Humidity
60M2C
120V220
20min.
90V95L
Applied current Rated current
Applied voltage DC50V Y 5mA
24
Duration
500Mꢀ
0
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber.
L/L
Impedance
LERYLEMYLBH
22.Hirh temperaturte
life test
L/L
L/L WithinM10L
L/L
Refer to individual Temperature 85M2C
WithinM5L
L/L
WithinM10L
Q
WithinM10L
Q
specification.
DC resisitance
Refer to individual
specification.
Insulation
Duration 1000 hrs
within
0.5nH
under
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
5R6V18N
10min.
10N 10min.
12NV33N
15min.
22NVR10
15min.
8.2
H
39NVR10
20min.
resisitance
Q/Q
R12V1R0
25min.
withinM20L Refer to individual CM03MS Series
R12V4R7
30min.
specification No
CM03MS
60M2C
1R2V3R3
20min.
disconnection or
short circuit.
Temperature
Duration
5R6V330
25min.
500M 204
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber.
L/L
390V820
20min.
WithinM10L
Q
101 15min.
10NV18N
10min.
22NVR10
15min.
R12V100
30min.
L/L
L/L WithinM10L
L/L
Impedance
LERYLB
23.Loading at high
temperature
WithinM10L
Q
WithinM5L
L/L
Refer to individual Temperature 85M2C fExcluding nH rangeg
specification.
Duration 1000 hrs
R12V1R0
25min.
withinM0.5nH DC resisitance
under
8.2
Q/Q
Applied current Rated current
Refer to individual Recovery At least 1 hr of recovery the stan-
1R2V3R3
20min.
H
specification.
Insulation
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
WithinM20L resisitance
Refer to individual
L/L
WithinM10L
Q
specification No CM03MS Series
disconnection or
CM03MS
R12V100
30min.
short circuit.
Temperature
85M3C
Applied current Rated current
120V220
20min.
Applied voltage DC50V Y 5mA
24
Duration
500Mꢀ
0
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber.
239
8/8
RELIABILITY DATAꢀ
Specified Value
Item
Test Methods and Remarks
LER012
LEM2520
LER015
LEMC2520 LEMF2520 LEMC3225 LEMF3225
LB2518
LB2016
LB2012
LBH1608
CM03MS
LERYLEMYLB
24.Low temperature
life test
L/L
L/L
L/L WithinM10L
L/L
Impedance
Temperature K40M2C
WithinM10L
Q
WithinM10L
Q
WithinM5L
L/L
Refer to individual
specification.
Duration 1000 hrs
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber, followed by
measurement within 2 hrs.
CM03MS Series
10N 10min.
12NV33N
15min.
5R6V18N
10min.
withinM0.5nH DC resisitance
under
8.2
Q/Q
Refer to individual
specification.
Insulation
22NVR10
15min.
H
39NVR10
20min.
5
R12V1R0
25min.
WithinM20L resisitance
Refer to individual
CM03MS
R12V4R7
30min.
Temperature K40M3C
1R2V3R3
20min.
specification No
disconnection or
short circuit.
24
Duration
500Mꢀ
0
5R6V330
25min.
Recovery At least 1 hr of recovery the stan-
dard condition after the removal
from test chamber.
L/L
390V820
20min.
M10L
101 15min.
Q
10NV18N
10min.
22NVR10
15min.
R12V100
30min.
120V220
20min.
25.Insulation Resis-
tance
100MEmin.
CM03MS Series
Applied voltage Rated voltage
Duration 60 sec.
26.Rated Voltage
Within the
specification
No abnormality
27.Withstanding volt-
age
CM03MS Series
Applied voltage Rated voltage
Duration 60 sec.
28.Standard condition "Sutandard condition" referred to herein defined as follows 5 to Standard test condition Unless oherwise "Sutandard condi-
35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa specified,Temperature20M15 of tempera- tion" referred to
of air pressure.When there are questions concerning measure- ture, 65M20L of relative humidity. When herein defined as
ment results In order to provide correlation data, the test shall be there are question concerning measurement follows 5 to 35
conducted under condition of 20M2 of temperature, 45 to 85L to result In order to provide correlation date, of temperature, 45
106kPa of air pressure. Unless otherwise specified all the test are the test shall be condition of 20M2 of to 85% relative hu-
conducted under the "standard condition"
tenterature, 65M5L relative humidity.
インダクタンス 当社 を標準
いし
midity, and 86
to106kPa of air
pressure.When
there are questions
concerning mea-
surement results
値
。
In order to provide
correlation data,
the test shall be
conducted under
condition of 20
2
of temperature,
45 to 85% relative
humidity, and 86 to
106kPa of air pres-
sure. Unless other-
wise specified all
the test are con-
ducted under the
"standard condi-
tion"
241
梱包ꢀPACKAGING
1標準数 Standard Quantity
ꢀꢀꢀꢀ
ꢀꢀꢀꢀꢀ標準数
Standard Quantity
チップ
Chip Cavity
A
ピッチ テープ
[pcs]
形ꢀꢀ式
形ꢀ式ꢀ
ꢀꢀꢀꢀꢀꢀꢀꢀ
Insertion Pitch
Tape Thickness
Type
Type
め
ꢀꢀꢀテーピング
B
F
K
T
ꢀ
ꢀ
ꢀ
ꢀ
2.15M0.1
2.7M0.1
4.0M0.1
2.1
0.3
ꢀꢀꢀꢀꢀBulk / Bag
ꢀꢀꢀTape&Reel
LB2518
LB2016
LB2012
LBH1608
f0.085M0.004g f0.107M0.004g f0.157M0.004g f0.083g f0.012g
LB2518
LB2016
LB2012
LBH1608
2000
2000
3000
4000
2000
2000
3000
4000
1.9M0.1
2.2M0.1
4.0M0.1
2.15
0.3
f0.075M0.004g f0.087M0.004g f0.157M0.004g f0.085g f0.012g
1.5M0.2
2.3M0.2
4.0M0.1
2.0
0.3
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.079g f0.012g
1.1max 1.1max
5
1.0M0.2
1.8M0.2
4.0M0.1
f0.059M0.008g f0.091M0.008g f0.157M0.004g f0.079g f0.012g
Unit: mm (inch)
2テーピング
Tape material
4リーダ
Leader and Blank Portion
5リー 寸法 Reel Size
3テーピング寸法ꢀTaping Dimensions
エン ステープ 8mm Embossed Tape (0.315 inches wide)
テープ 8mm Paper tape (0.315 inches wide)
10M1.5
(0.394M0.059)
6
ップテープ
Top Tape Strength
ップテープの がし
、
図
0.2 0.7N
。
The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the
arrow as illustrated below.
225
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